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RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,
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Kappa 438 RF Printed Circuit Board Rogers 30mil 0.762mm DK 4.38 PCB with Immersion Gold for Small Cells

Shenzhen Bicheng Electronics Technology Co., Ltd
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Kappa 438 RF Printed Circuit Board Rogers 30mil 0.762mm DK 4.38 PCB with Immersion Gold for Small Cells

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Brand Name : Bicheng Technologies Limited

Model Number : BIC-0163-V5.6

Certification : UL

Place of Origin : China

MOQ : 1

Price : USD2.99-8.99 Per Piece

Payment Terms : T/T, Paypal

Supply Ability : 45000 pieces per month

Delivery Time : 5-6 working days

Packaging Details : Vacuum

Glass Epoxy : Kappa 438

Final height of PCB : 0.8 mm ±0.1mm

Final foil external : 1 oz

Surface Finish : Immersion gold 0.05 micron over nickle 4.4 micron

Solder Mask Color : NO

Colour of Component Legend : NO

TEST : 100% Electrical Test prior shipment

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Rogers RF PCB Built on Kappa 438 30mil 0.762mm DK 4.38 with Immersion Gold for Small Cells.
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible.

Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed.

Features
1. Glass reinforced hydrocarbon thermoset platform
2. Dk of 4.38 is tailored to FR-4 industry standard norms
3. Tighter Dk and thickness tolerance than FR-4
4. Low Z Axis CTE of 42 ppm/°C
5. High Tg of > 280°C TMA
6. Meets UL 94-V0 requirements


Benefits
1. Ease of PCB manufacturing and assembly in Line with FR-4
2. Design Dk enables ease of converting existing FR-4 designs needing better electrical performance
3. Consistent circuit performance
4. Improved design flexibility and plated through-hole reliability
5. Automated assembly compatible

Typical Applications:
1. Carrier Grade WiFi/Licensed Assisted Access (LAA)
2. Small Cell and Distributed Antenna Systems (DAS)
3. Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)
4. Internet of Things (IoT)
Segments: Smart Home and Wireless Meters

Kappa 438 RF Printed Circuit Board Rogers 30mil 0.762mm DK 4.38 PCB with Immersion Gold for Small Cells

Kappa 438 RF Printed Circuit Board Rogers 30mil 0.762mm DK 4.38 PCB with Immersion Gold for Small Cells

Our PCB Capability (Kappa 438)

PCB Material:Glass Reinforced Hydrocarbon Ceramic
Designation:Kappa 438
Dielectric constant:4.38
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm)
PCB thickness:20mil (0.508mm) 30mil(0.762mm) 40mil(1.016mm) 60mil (1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..



Data Sheet of Kappa 438 Laminate

PropertyTypical Value Kappa 438DirectionUnitsConditionTest Method
Dielectric Constant, er Design4.38Z-2.5 GHzDifferential Phase Length Method
Dissipation Factor tan, d0.005Z-10 GHz/23°CIPC-TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant e-21-ppm/°C10 GHz (-50 to 150°C)Modified IPC-TM-650 2.5.5.5
Volume Resistivity2.9 x 109-MΩ•cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity6.2 x 107-MΩCOND AIPC-TM-650 2.5.17.1
Electrical Strength675ZV/mil-IPC-TM-650 2.5.6.2
Tensile Strength16 12MD CMDkpsi-ASTM D3039/D3039-14
Flexural Strength25 19MD CMDkpsi-IPC-TM-650 2.4.4
Dimensional Stability-0.48-0.59MD CMDmm/m-IPC-TM-650 2.4.39a
Coefficient of Thermal Expansion13Xppm/°C-55 to 288°CIPC-TM-650 2.4.41
16Y
42Z
Thermal Conductivity0.64ZW/(m.K)80°CASTM D5470
Time to Delamination (T288)>60-minutes288°CIPC-TM-650 2.4.24.1
Tg>280-°C TMA-IPC-TM-650 2.4.24.3
Td414-°C-IPC-TM-650 2.3.40
Moisture Absorption0.07-%24/23IPC-TM-650 2.6.2.1
Young’s Modulus2264 2098MD CMDkpsi-ASTM D3039/D3039-14
Flex Modulus2337 2123MD CMDkpsi-IPC-TM-650 2.4.4
Bow0.03-%-IPC-TM-650 2.4.22C
Twist0.08-%-IPC-TM-650 2.4.22C
Copper Peel Strength After Thermal Stress5.8-lbs/in1 oz (35 µm) foilIPC-TM-650 2.4.8
FlammabilityV-0---UL 94
Specific Gravity1.99-g/cm3-ASTM D792
Lead-Free Process CompatibleYes---

Kappa 438 RF Printed Circuit Board Rogers 30mil 0.762mm DK 4.38 PCB with Immersion Gold for Small Cells




































China Kappa 438 RF Printed Circuit Board Rogers 30mil 0.762mm DK 4.38 PCB with Immersion Gold for Small Cells factory

Kappa 438 RF Printed Circuit Board Rogers 30mil 0.762mm DK 4.38 PCB with Immersion Gold for Small Cells Images

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