: Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

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12-Layer BGA PCB, HDI PCB Blind via, Buried via Multi-layer PCB, High density

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Shenzhen Bicheng Electronics Technology Co., Ltd

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12-Layer BGA PCB, HDI PCB Blind via, Buried via Multi-layer PCB, High density

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12-Layer BGA PCB, HDI PCB Blind via, Buried via Multi-layer PCB, High density

Why do we need to use via in PCB? And its Parasitic Capacitance and Parasitic Inductance Tag# PCB design, Multi-layer PCB, High density interconnection PCB PCB holes Via is one of the important parts ...

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